Thermal Modeling and Simulation of 12V Gen3 eXtreme Switch Deives with SPICE
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چکیده
This Application Note presents a SPICE-based method for thermal modeling, simulation and design of a multi-channel power semiconductor switch on a Printed Circuit Board (PCB). The method allows rapid and simultaneous determination of the temperature of semiconductor junctions and the PCB track below the device, both under transient conditions and at steady-state. The model takes thermal cross-coupling between the device’s channels into account.
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